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Semiconductor Manufacturing, Fabrication, And Processing
Wafer Handling & Transport
Wafer Coater & Lithography
Etching, Cleaning & Ion Implant
Assembly & Testing, SMT
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Wafer Handling & Transport
The wafer is handled during the fabrication process in machine to machine handling and while inside the machine. Examples of this are wafer cassette transportation by conveyor, AGV, elevators, and wafer handling robots between cassette to chambers. During the process, this handling can occur over a 100 times between the thin film layer formation, wafer coating, lithography, etching & cleaning steps. MISUMI's configurable rotary motion products such as rotary shafts, timing pulleys, belts, ball bearings, and more are useful components here.
Wafer Coater & Lithography
The wafer coating and lithography steps are a major part of the process of wafer fabrication and require high precision tooling with a high level clean environment. For these processes, linear motion and locating components, including precision stages, are usually required. Along with these components, the laser autocollimator is a part of the alignment process commonly used in wafer coater & lithography process as well.
Etching, Cleaning & Ion Plant
Wafers are transferred to chambers to be etched and cleaned. After this, they are processed further in the ion implant stage where they are implanted with layers of functions, resulting in an electric circuit. For this step, mechanical components, vacuum components , and piping components with chemical strength and high temperature limits are required. Fasteners of different varieties are also used in great abundance here.
Assembly & Testing, SMT
Fabricated wafers are moved to the next stage of assembly into a semiconductor devices. They are then tested to ensure their function and are ready for use on the PCB (Printed Circuit Board) by SMT (Surface Mount Technology). Clean components, as well as linear, rotary, and other automation components such as hardwires are commonly used for this process.
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